Abstract
<jats:p>Relevance. Copper metal matrix composites are widely used in advanced engineering applications involving extreme mechanical loads and increased heat flows. They are particularly important in the electronics industry, where they are used as substrates for discrete power components and heat sinks. These materials can effectively dissipate heat from electronic components, which is important given the predicted growth in local heat flows in high-performance devices and their miniaturization. Aim. To synthesize copper powders and metal matrix composites with a copper matrix with arc discharge plasma, for use in the subsequent manufacture of bulk products that have enhanced mechanical and thermophysical properties. Objects. Copper powders, tungsten carbide powders, and metal matrix composites with a copper matrix reinforced with tungsten carbide, as well as bulk products made from these powders. Methods. Plasma dynamic synthesis, spark plasma sintering, X-ray diffractometry (XRD analysis), scanning electron microscopy, transmission electron microscopy, indentation (microhardness measurement), laser flash method (thermal conductivity measurement). Results. The plasma dynamic method was used to synthesize powders of copper, nanodispersed tungsten carbide and metal matrix composites based on them. Two fundamental approaches were proposed: ex situ, which is based on the separate production of copper (Cu) and carbides, followed by their mixing; and in situ, which involves the joint production and combination of the matrix and carbides. The authors obtained the dispersed metal matrix composites with a carbide content of 10% and a bimodal particle size distribution ranging from tens of nanometres to hundreds of micrometres. This enabled high-density composite products to be obtained with a relative density of up to 95% and a uniform distribution of the ceramic component in the matrix during sintering. The manufactured composite materials demonstrated significant potential in terms of both their mechanical and thermophysical properties. The bulk products exhibited increased hardness (73–92 HV), combined with satisfactory thermophysical characteristics (λ up to 169 W/m·K). These results may be valuable in developing modern materials capable of operating under extreme mechanical and thermal conditions, a serious problem currently facing the electronics industry.</jats:p>